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INNOVATION
Polymer-based flip-chip PolyBoard platform for insertion of photonics chips
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Market Maturity: Exploring
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Market Creation Potential
This innovation was assessed by the JRC’s Market Creation Potential indicator framework as addressing the needs of existing markets and existing customers. Learn more
Go to Market needs
Needs that, if addressed, can increase the chances this innovation gets to (or closer to) the market incude:
  • Scale-up market opportunities
Location of Key Innovators developing this innovation
Key Innovators
UN Sustainable Development Goals(SDG)
This innovation contributes to the following SDG(s)
SUSTAINABLE DEVELOPMENT GOAL 9
Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation

The UN explains: "Investments in infrastructure – transport, irrigation, energy and information and communication technology – are crucial to achieving sustainable development and empowering communities in many countries. It has long been recognized that growth in productivity and incomes, and improvements in health and education outcomes require investment in infrastructure."

The EU-funded Research Project
This innovation was developed under the Horizon 2020 project POETICS with an end date of 31/12/2023
  • Read more about this project on CORDIS
Description of Project POETICS
Enabling Terabit capacity optical interconnects requires a paradigm shift in the packaging approach. The electrical interconnect distance between the optical engine (OE) and the digital switching chip must be minimised, removing signal conditioning chips and unwanted components like sockets that would otherwise be required and would inevitably lead to increased power consumption and lower signal integrity. It also requires the right combination of photonic and electronic technology that will be integrated to deliver high performance, low-cost and energy efficient optical engines. This approach has the potential to remove the optical interconnect bandwidth bottlenecks and allow DC networks and the 5G wired infrastructure, which heavily rely on them, to grow. POETICS is a research proposal that targets the development of novel Terabit optical engines and optical switching circuits and to copackage them with digital switching chips to realise Multi-Chip Modules (MCM) with Tb/s capacities, very high energy efficiency that fit into the roadmap of vendors. In order to do so POETICS will utilize SiGe BiCMOS, InP, PolyBoard and TriPleX technologies and rely on hybrid integration, which allows the selection and combination of the best performing components. POETICS in specific targets 1) MCM with 1.6Tb/s OEs based on 8-fold InP-EML arrays (200Gb/s per lane) and PolyBoard with parallel SMFs on par with the PSM/DR spec for 500m-2km intra-DC connectivity. 2) MCM with 1.6Tb/s OEs based on 8-fold InP-EML arrays (200Gb/s per lane) and 3D PolyBoard with duplex MCFs for 5G optical fronthaul applications 3) low power consumption 3D Benes optical switch 4) MCM coherent 64Gbaud OEs with up to 600Gb/s capacity of DC interconnect applications within 80-120 km reach on par with 400G-ZR specification.

Innnovation Radar's analysis of this innovation is based on data collected on 15/02/2024.
The unique id of this innovation in the European Commission's IT systems is: 119182